9th International Conference on
Solidification Science & Processing
| December 05โ08, 2026 |
Indian Institute of Technology Hyderabad (IITH) |
We are delighted to announce ICSSP9, the 9th "International Conference on Solidification Science and Processing" and we are particularly happy to invite you to join us in Hyderabad from Dec 05-08, 2026 at IIT Hyderabad (IITH)! The ICSSP Conference series is a triennial event for researchers to present and discuss the latest advances and future directions in solidification science, which was first held at Bangalore in 2001. Subsequently, it was held at Bangalore (2004), Jaipur (2006), Chennai (2009), Bhubaneswar (2012), Hyderabad (2015), Trivandrum (2018) and Jodhpur(2023).
The aim of this conference is to bring together academicians, scientists, technologists and students working in the field of solidification science and processing to discuss the recent developments and review the challenges faced by the community. The conference consists of invited oral presentations and contributed posters. To ensure an intense interaction amongst the researchers, ICSSP is always held in a single session mode without any parallel sessions. Students are encouraged to present their work through poster sessions. Best posters will be judged and awarded during the conference. The topics of interest for ICSSP9 include but are not limited to:
Fundamentals of Solidification & Melting
Modelling of Solidification including multiscale modelling methods and through-process modelling.
Microstructure Evolution during solidification, grain refinement and remelting.
Rapid Solidification, advances in solidification processes.
Thermophysical Properties and phase equilibria.
Multiphase Flow, heat & mass transfer, mushy zone rheology, and micro & macro segregation.
Stress & Deformation during solidification, hot tearing, shrinkage, porosity, and other defects.
Additive Manufacturing and welding technologies.
Solidification under Microgravity and external fields, directional solidification.
In-situ Observation of solidification and melting phenomena.
Advanced Characterization.
Solidification of Composites and metallic foams.
Industry 5.0 in relation to casting and foundry technologies.
 Prof. Dr. Gerhard Wilde Chairman University of Muenster, Germany |
 Prof. B.S. Murty Co-Chairman IIT Hyderabad |
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 Dr. Mayur Vaidya Convener IIT Hyderabad |
 Dr. Rajesh Korla Co-Convener IIT Hyderabad |
 Dr. Niraj Chawake Co-Convener IIT Kanpur |
 Dr. Sairam K. Malladi Treasurer IIT Hyderabad |
The details will be updated soon.
Conference fee includes registration kit, conference attendance, lunches, welcome dinner banquet, hosted dinners and a city tour. For Overseas registered participants, registration fee includes the accommodation charges from December 5-8, 2026 at IITH International Guest House (IGH).
Early Registration until August 31, 2026
| Type | Overseas* | India** | |
|---|---|---|---|
| Participant | Early Registration | US$ 500 | Rs. 12000 |
| Late Registration | US$ 600 | Rs. 15000 | |
| Spouse/Student | Early Registration | US$ 250 | Rs. 6000 |
| Late Registration | US$ 300 | Rs. 7500 |
*Taxes not applicable
** Includes 18% GST
The details will be updated soon.
The details will be updated soon.
ICSSP9 Secretariat
Indian Institute of Technology Hyderabad (IITH)
Kandi, Sangareddy, Telangana, India
Email: icssp9@msme.iith.ac.in
Website: www.icssp9.msme.iith.ac.in